Solder Ball Jetting Process Capabilities

Capability data is most useful when it is connected to a specific system and application. The supplied materials include approximate ball application of 0.2–0.9 mm, maximum soldering frequency up to 6 dots/s, a documented ±10 μm vision-positioning value and 100/200 W laser configuration. These values are not a universal product specification.

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Ball diameter

Ball size must be related to pad dimensions, target joint volume and physical access. A narrower or different range may apply in another configuration or application.

Process frequency

A maximum dot rate is not a complete cycle-time answer. Part transfer, vision, motion travel, fixture actions and inspection can all affect the usable process sequence.

Positioning

Positioning performance depends on the motion system, datum strategy, vision conditions, fixture stability and component presentation. The published value should remain connected to the documented system.

Laser configuration

The 100/200 W reference identifies available configuration in the supplied information. Final selection follows the process test and does not imply identical equipment across every configuration.

Supplied process video

CCD positioning and machine operation

Supplied footage used to illustrate positioning and machine-operation context.

Supplied video frame marked 0.25 ball 0.4 pitch during solder ball processing — Fine-pitch demonstration
Demonstration of 0.25 mm solder ball processing on a 0.4 mm pitch test pattern.

Supplied video frame of a precision soldering machine operating around a fixture — Machine operation
Real machine-operation context from the CCD positioning footage.

Supplied video frame of CCD machine operation and positioning interface — Process interface
Vision and machine-operation evidence; final setup remains application dependent.

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Share drawings, sample photographs or soldering requirements. The engineering discussion can connect the component to a suitable process and machine configuration.

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